Triple patterning NAND flash memory with SOC

ABSTRACT

A NAND flash memory array is initially patterned by forming a plurality of sidewall spacers according along sides of patterned portions of material. The pattern of sidewall spacers is then used to form a second pattern of hard mask portions including first hard mask portions defined on both sides by sidewall spacers and second hard mask portions defined on only one side by sidewall spacers.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is related to “Triple patterning NAND flash memory” and“Triple patterning NAND flash memory with stepped mandrel” filed on thesame date as the present application.

BACKGROUND OF THE INVENTION

This invention relates generally to non-volatile semiconductor memoriesof the flash EEPROM (Electrically Erasable and Programmable Read OnlyMemory) type, their formation, structure and use, and specifically tomethods of making NAND memory cell arrays.

There are many commercially successful non-volatile memory productsbeing used today, particularly in the form of small form factor cards,which use an array of flash EEPROM cells. An example of a flash memorysystem is shown in FIG. 1, in which a memory cell array 1 is formed on amemory chip 12, along with various peripheral circuits such as columncontrol circuits 2, row control circuits 3, data input/output circuits6, etc.

One popular flash EEPROM architecture utilizes a NAND array, wherein alarge number of strings of memory cells are connected through one ormore select transistors between individual bit lines and a referencepotential. A portion of such an array is shown in plan view in FIG. 2A.BL0-BL4 represent diffused bit line connections to global vertical metalbit lines (not shown). Although four floating gate memory cells areshown in each string, the individual strings typically include 16, 32 ormore memory cell charge storage elements, such as floating gates, in acolumn. Control gate (word) lines labeled WL0-WL3 and string selectionlines DSL and SSL extend across multiple strings over rows of floatinggates. Control gate lines and string select lines are formed ofpolysilicon (polysilicon layer 2, or “poly 2,” labeled P2 in FIG. 2B, across-section along line A-A of FIG. 2A). Floating gates are also formedof polysilicon (polysilicon layer 1, or “poly 1,” labeled P1). Thecontrol gate lines are typically formed over the floating gates as aself-aligned stack, and are capacitively coupled with each other throughan intermediate dielectric layer (also referred to as “inter-polydielectric” or “IPD”) as shown in FIG. 2B. This capacitive couplingbetween the floating gate and the control gate allows the voltage of thefloating gate to be raised by increasing the voltage on the control gatecoupled thereto. An individual cell within a column is read and verifiedduring programming by causing the remaining cells in the string to beturned on hard by placing a relatively high voltage on their respectiveword lines and by placing a relatively lower voltage on the one selectedword line so that the current flowing through each string is primarilydependent only upon the level of charge stored in the addressed cellbelow the selected word line. That current typically is sensed for alarge number of strings in parallel, thereby to read charge level statesalong a row of floating gates in parallel. Examples of NAND memory cellarray architectures and their operation are found in U.S. Pat. Nos.5,570,315, 5,774,397, 6,046,935, and 7,951,669.

Nonvolatile memory devices are also manufactured from memory cells witha dielectric layer for storing charge. Instead of the conductivefloating gate elements described earlier, a dielectric layer is used.Such memory devices utilizing dielectric storage element have beendescribed by Eitan et al., “NROM: A Novel Localized Trapping, 2-BitNonvolatile Memory Cell,” IEEE Electron Device Letters, vol. 21, no. 11,November 2000, pp. 543-545. An ONO dielectric layer extends across thechannel between source and drain diffusions. The charge for one data bitis localized in the dielectric layer adjacent to the drain, and thecharge for the other data bit is localized in the dielectric layeradjacent to the source. For example, U.S. Pat. Nos. 5,768,192 and6,011,725 disclose a nonvolatile memory cell having a trappingdielectric sandwiched between two silicon dioxide layers. Multi-statedata storage is implemented by separately reading the binary states ofthe spatially separated charge storage regions within the dielectric.

The top and bottom of the string connect to the bit line and a commonsource line respectively through select transistors (source selecttransistor and drain select transistor) in which the floating gatematerial (P1) is in direct contact with the control gate material (P2)through an opening formed in IPD material. The active gate thus formedis electrically driven from the periphery.

It is generally desirable to make memory cells as small as possible sothat the number of memory cells in a given area is maximized. Thus, forexample, when forming word lines, it may be desirable to make them asnarrow as possible and space them as closely as possible. However,achieving such small dimensions while maintaining control of criticaldimensions can be very difficult. A complex process that includes alarge number of steps generally costs more and may have a lower yieldand may be harder to control. Conventional photolithography is generallylimited by the wavelength of light used. Alternatives such as e-beamlithography remain costly.

Thus, there is a need for a memory chip manufacturing process that usesconventional photolithography to make very small features in a mannerthat does not require an excessive number of layers, or process steps,and that allows good control of device dimensions.

SUMMARY OF THE INVENTION

Patterning to form integrated circuits may use sidewall spacers togenerate features that are one third of the size of the smallest featurethat can be achieved with direct patterning photolithography. An initialpattern of mandrels is established using photolithography with featuresize D, and spacing D. Sidewall spacers are formed having a width of D/3so that remaining gaps are D/3 wide. Mandrels are removed and a hardmask material is blanket deposited with a thickness of D/3 to fill gapsbetween sidewall spacers and partially fill spaces where mandrels wereremoved. The hard mask layer is then etched back to leave separate hardmask portions, two portions where each mandrel was removed, and oneportion between sidewall spacers of neighboring mandrels. Thus, threehard mask portions, each with a lateral dimension of D/3 and spacingD/3, are formed for each mandrel with lateral dimension D and spacing D.Spin On Carbon (SOC) is a suitable material for an easily removablemandrel. Photoresist, or other material, may also be used as a mandrel.Sidewall spacers may be Silicon Dioxide or other suitable material. Hardmask material may be amorphous Silicon, Silicon Nitride, or othermaterial.

Stepped mandrels may be formed with an upper step having a width D/3 anda lower step having a width D. Sidewall spacers may then be formed alongsides of both upper and lower steps, and hard mask material may bedeposited between sidewall spacers. Upper steps may then be removed toleave openings that are used to remove the middle third of lower steps,leaving two lower step portions, each D/3 wide. Subsequently, upper andlower sidewall spacers may be removed and hard mask material etched backto leave hard mask portions that include the two lower step portions.

An example of a method of forming a hard mask layer includes: forming aplurality of portions of material that have a lateral dimension D whichis defined by a photolithographic process and which are separated byspaces having a lateral dimension equal to D; subsequently formingsidewall spacers along sides of the plurality of portions of material,gaps between neighboring sidewall spacers having a lateral dimensionequal to D/3; subsequently removing the plurality of portions ofmaterial to leave the sidewall spacers; subsequently depositing a hardmask material on the sidewall spacers to fill the gaps between sidewallspacers and partially fill openings where the plurality of portions ofmaterial were removed; subsequently etching back the hard mask materialto leave first hard mask portions filling the gaps between sidewallspacers and second hard mask portions that extend along sidewall spacerson one side and are exposed on another side; and subsequently removingthe sidewall spacers.

The material may be Spin-On Carbon (SOC). The plurality of portions ofSOC may be removed by dry etching. The sidewall spacers may be formed ofSilicon Dioxide that is deposited at a low temperature. The hard maskmaterial may be amorphous Silicon. The hard mask material may be SiliconNitride. The sidewall spacers may be formed of Silicon Dioxide, a layerthat directly underlies the sidewall spacers may be formed of SiliconDioxide, and the layer that directly underlies the sidewall spacers maybe patterned by an etch that also removes the sidewall spacers. Both thefirst and second hard mask portions may have lateral dimensions of D/3and spacing of D/3.

An example of a method of forming an integrated circuit includes:forming a plurality of patterned portions of a first material;subsequently forming sidewall spacers along sidewalls of the pluralityof patterned portions of the first material; subsequently removing theplurality of patterned portions of the first material; subsequentlyforming a layer of hard mask material overlying the sidewall spacers;subsequently etching back the layer of hard mask material to leaveportions of the hard mask material between sidewall spacers includingfirst portions that are in contact with sidewall spacers on both sidesand second portions that are in contact with sidewall spacers on onlyone side; subsequently removing the sidewall spacers; and subsequentlyusing the portions of the hard mask material to pattern one or morelayers on a substrate.

The first material may be Spin-On Carbon (SOC). The sidewall spacers maybe formed of Silicon Dioxide that is deposited at a low temperature. Thehard mask material may be amorphous Silicon. The hard mask material maybe Silicon Nitride. The sidewall spacers may be formed of SiliconDioxide, a layer that directly underlies the sidewall spacers may beformed of Silicon Dioxide, and the layer that directly underlies thesidewall spacers may be patterned by an etch that also removes thesidewall spacers. The plurality of patterned portions of the firstmaterial may be formed having a lateral dimension determined byphotolithography and the portions of the hard mask material may have alateral dimension that is approximately one third of the lateraldimension determined by photolithography.

An example of a method of forming an integrated circuit includes:forming a plurality of patterned portions of photoresist; subsequentlyforming sidewall spacers along sidewalls of the plurality of patternedportions of photoresist; subsequently removing the plurality ofpatterned portions of photoresist; subsequently transferring a patternformed by the sidewall spacers to form a plurality of patterned portionsof a transfer material; subsequently forming a layer of hard maskmaterial overlying the patterned portions of the transfer material;subsequently etching back the layer of hard mask material to leave hardmask portions between the patterned portions of the transfer material,the hard mask portions including first hard mask portions that are incontact with portions of transfer material on both sides and second hardmask portions that are in contact with portions of transfer material ononly one side; subsequently removing patterned portions of the transfermaterial; and subsequently using the hard mask portions to pattern oneor more layers on a substrate.

The plurality of patterned portions of photoresist may have a lateraldimension of approximately D and may be spaced apart a distanceapproximately equal to D, and the hard mask portions may have a lateraldimension approximately equal to D/3 and may be spaced apart a distanceapproximately equal to D/3. The sidewall spacers may be formed ofSilicon Dioxide. The transfer material may be Spin On Carbon (SOC).

An example of a method of forming a hard mask layer includes: forming aplurality of mandrels that have a lateral dimension D which is definedby a photolithographic process and which are separated by spaces havinga lateral dimension equal to D; subsequently forming sidewall spacersalong sides of the mandrels, gaps between neighboring sidewall spacershaving a lateral dimension approximately equal to D/3; subsequentlydepositing a first hard mask layer to fill the gaps between sidewallspacers; subsequently etching the plurality of mandrels; subsequentlydepositing a second hard mask layer to partially fill openings where theplurality of mandrels were etched; subsequently etching back hard maskmaterial to leave first hard mask portions filling the gaps betweensidewall spacers and second hard mask portions that extend alongsidewall spacers on one side and are exposed on another side; andsubsequently removing the sidewall spacers.

An individual mandrel may be formed of a lower layer of amorphousSilicon and an upper layer of Silicon Nitride. Etching the plurality ofmandrels may remove the upper layer of Silicon Nitride from theplurality of mandrels while leaving the lower layer of amorphous Siliconsubstantially intact. The plurality of mandrels, and the sidewallspacers, may be formed on a Silicon Nitride etch stop layer. Subsequentto removing the sidewall spacers, the Silicon Nitride etch stop layermay be etched through according to a pattern established by the firstand second hard mask portions. The first hard mask layer and the secondhard mask layer may be formed of amorphous Silicon. The sidewall spacersmay be formed of Silicon Dioxide. The plurality of mandrels may consistof Silicon Nitride, the sidewall spacers may be formed of SiliconDioxide, the first hard mask layer and the second hard mask layer may beformed of amorphous Silicon, and a layer of amorphous Silicon maydirectly underlie the plurality of mandrels and the sidewall spacers.Etching the plurality of mandrels may remove the plurality of mandrelsto expose the layer of amorphous Silicon. The second hard mask layer maybe deposited directly on exposed areas of the layer of amorphousSilicon. Both the first and second hard mask portions may have lateraldimensions of approximately D/3 and spacing of approximately D/3.

An example of a method of forming an integrated circuit includes:forming a plurality of patterned portions using direct patterningphotolithography; subsequently forming sidewall spacers along sidewallsof the plurality of patterned portions; subsequently filling gapsbetween sidewalls of neighboring patterned portions with first hard maskportions; subsequently removing the plurality of patterned portions;subsequently forming second hard mask portions in spaces where theplurality of patterned portions were removed, two second hard maskportions being formed in each space where an individual patternedportion was removed; subsequently removing the sidewall spacers; andsubsequently using the first and second portions of the hard maskmaterial to pattern one or more layers on a substrate.

The patterned portions may be formed of Silicon Nitride, or acombination of Silicon Nitride and amorphous Silicon. The sidewallspacers may be formed of Silicon Dioxide. The first and second hard maskportions may be formed of amorphous Silicon. A layer that directlyunderlies the sidewall spacers may be formed of Silicon Dioxide. Theplurality of patterned portions may be formed having a lateral dimensionD and the first and second hard mask portions may have a lateraldimension that is approximately one third of the lateral dimension D.

An example of a method of forming an integrated circuit includes:forming a plurality of mandrels; forming sidewall spacers along sides ofthe plurality of mandrels; subsequently removing the plurality ofmandrels; subsequently depositing and etching a layer of sacrificialmaterial to form first sacrificial portions between sidewall spacers andsecond sacrificial portions in openings where mandrels were removed, twosecond sacrificial portions formed per opening; subsequently formingfiller portions in gaps between second sacrificial portions;subsequently removing the first and second sacrificial portions to leavethe sidewall spacers and the filler portions; and subsequently using thesidewall spacers and the filler portions as a hard mask to pattern oneor more layers.

The plurality of mandrels may be formed of Silicon Dioxide. The sidewallspacers and the filler portions may be formed of amorphous Silicon. Thesacrificial material may be Silicon Dioxide. The sidewall spacers andthe filler portions may be used as a hard mask to pattern an underlyinglayer of Silicon Nitride.

An example of a method of forming a hard mask layer includes: forming aplurality of stepped mandrel structures, an individual stepped mandrelstructure having a lower step portion that has a width D and an upperstep portion that has a width D/3, the upper step portion overlying amiddle area of an upper surface of the lower step portion; forming lowersidewall spacers along sides of the lower step portions; forming uppersidewall spacers along sides of the upper step portions; subsequentlydepositing a hard mask material to fill spaces between lower sidewallspacers; removing upper step portions; etching the lower step portionsaccording to a pattern of removed upper step portions so that anindividual lower step portion is patterned into a first hard maskportion having a width of D/3 and a second hard mask portion having awidth of D/3; and removing excess hard mask material to leave third hardmask portions between lower sidewall spacers.

Lower sidewall spacers and upper sidewall spacers may be formed togetherby depositing a blanket layer of sidewall spacer material and etchingback the blanket layer of sidewall spacer material. The lower and uppersidewall spacers may be formed of Silicon Nitride. The hard maskmaterial may be amorphous Silicon and the lower step portions may beformed of amorphous Silicon. The lower and upper sidewall spacers may beformed of amorphous Silicon. The hard mask material may be SiliconNitride and the lower step portions may be formed of Silicon Nitride.The lower and upper sidewall spacers may be formed of Silicon Dioxide.The upper step portion may be formed of Silicon Nitride, hard maskmaterial may be amorphous Silicon, and the lower step portions may beformed of amorphous Silicon. The upper step portions may be formed ofSilicon Dioxide. The lower sidewall spacers and upper sidewall spacersmay each have a width of D/3. Upper and lower step portions may beformed by direct pattern lithography to have an initial width D,followed by slimming of upper step portions to a width D/3.

An example of a method of forming an integrated circuit includes:forming a plurality of stepped mandrel structures, an individual steppedmandrel structure having an upper step portion overlying a middle areaof an upper surface of a lower step portion; forming lower sidewallspacers along sides of the lower step portions and forming uppersidewall spacers along sides of the upper step portions, the uppersidewall spacers overlying side areas of the upper surface of the lowerstep portion; subsequently depositing a hard mask material to fillspaces between stepped mandrel structures; subsequently etching thelower step portions according to a pattern established by the uppersidewall spacers so that an individual lower step portion is patternedinto a first hard mask portion and a second hard mask portion; andremoving excess hard mask material to leave a third hard mask portionbetween adjacent stepped mandrel structures.

The upper step portion may be formed of Silicon Dioxide, the lower stepportion may be formed of amorphous Silicon, the lower sidewall spacersand upper sidewall spacers may be formed of Silicon Nitride, and thehard mask material may be amorphous Silicon. The upper step portion maybe formed of Silicon Dioxide, the lower step portion may be formed ofSilicon Nitride, the lower sidewall spacers and upper sidewall spacersmay be formed of amorphous Silicon, and the hard mask material may beSilicon Nitride. The upper step portion may be formed of SiliconNitride, the lower step portion may be formed of amorphous Silicon, thelower sidewall spacers and the upper sidewall spacers may be formed ofSilicon Nitride, and the hard mask material may be amorphous Silicon.Lower sidewall spacers may be removed to leave first, second, and thirdsidewall spacers, each having a width of D/3 and spaced apart a distanceD/3. The first, second, and third sidewall spacers may be used toestablish a pattern of word lines of a NAND flash memory array.

Additional aspects, advantages and features of the present invention areincluded in the following description of examples thereof, whichdescription should be taken in conjunction with the accompanyingdrawings. All patents, patent applications, articles, technical papersand other publications referenced herein are hereby incorporated hereinin their entirety by this reference.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a prior art memory system.

FIG. 2A is a plan view of a prior art NAND array.

FIG. 2B is a cross-sectional view of the prior art NAND array of FIG. 2Ataken along the line A-A.

FIGS. 3A-3F illustrate a method of forming a NAND memory array.

FIG. 4 illustrates steps used to form a NAND memory array.

FIGS. 5A-5B illustrate another method of forming a NAND memory array.

FIGS. 6A-6B illustrate a method of forming a NAND memory array using SiNhard mask portions.

FIGS. 7A-7D illustrate a method of forming a NAND memory includingforming sidewall spacers on photoresist portions.

FIG. 8 illustrates steps used in the process of FIGS. 7A-7D.

FIGS. 9A-9B illustrate formation of smaller features in a memory arrayand larger features in a peripheral area of a memory die.

FIGS. 10A-10G illustrate another method of forming a NAND memory array.

FIGS. 11A-11F illustrate another method of forming a NAND memory array.

FIGS. 12A-12F illustrate another method of forming a NAND memory array.

FIGS. 13A-13F illustrate a method of forming a NAND memory array using astepped mandrel.

FIGS. 14A-14B illustrate another method of forming a NAND memory arrayusing a stepped mandrel.

FIG. 15A-15B illustrate another method of forming a NAND memory arrayusing a stepped mandrel.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Memory System

An example of a prior art memory system, which may be modified toinclude various aspects of the present invention, is illustrated by theblock diagram of FIG. 1. A memory cell array 1 including a plurality ofmemory cells M arranged in a matrix is controlled by a column controlcircuit 2, a row control circuit 3, a c-source control circuit 4 and ac-p-well control circuit 5. The memory cell array 1 is, in this example,of the NAND type similar to that described above in the Background andin references incorporated therein by reference. A control circuit 2 isconnected to bit lines (BL) of the memory cell array 1 for reading datastored in the memory cells (M), for determining a state of the memorycells (M) during a program operation, and for controlling potentiallevels of the bit lines (BL) to promote the programming or to inhibitthe programming. The row control circuit 3 is connected to word lines(WL) to select one of the word lines (WL), to apply read voltages, toapply program voltages combined with the bit line potential levelscontrolled by the column control circuit 2, and to apply an erasevoltage coupled with a voltage of a p-type region on which the memorycells (M) are formed. The c-source control circuit 4 controls a commonsource line (labeled as “c-source” in FIG. 1) connected to the memorycells (M). The c-p-well control circuit 5 controls the c-p-well voltage.

The data stored in the memory cells (M) are read out by the columncontrol circuit 2 and are output to external I/O lines via an I/O lineand a data input/output buffer 6. Program data to be stored in thememory cells are input to the data input/output buffer 6 via theexternal I/O lines, and transferred to the column control circuit 2. Theexternal I/O lines are connected to a controller 9. The controller 9includes various types of registers and other memory including avolatile random-access-memory (RAM) 10.

The memory system of FIG. 1 may be embedded as part of the host system,or may be included in a memory card, USB drive, or similar unit that isremovably insertible into a mating socket of a host system. Such a cardmay include the entire memory system, or the controller and memoryarray, with associated peripheral circuits, may be provided in separatecards. Several card implementations are described, for example, in U.S.Pat. No. 5,887,145. The memory system of FIG. 1 may also be used in aSolid State Drive (SSD) or similar unit that provides mass data storagein a tablet, laptop computer, or similar device.

Many integrated circuits are formed using photolithographic patterningto establish dimensions of components. In some cases, direct patterningis used to create a pattern in a photoresist layer that is thentransferred to a layer of material that becomes part of the integratedcircuit. The dimensions of features formed by such direct patterning aregenerally limited by the minimum feature size achievable with theparticular photolithographic process used (i.e. the smallest portion ofphotoresist, or opening in photoresist, that can be formed).

Some integrated circuits are formed using Sidewall Assisted Patterning(SAP), in which sidewalls are formed that may have smaller dimensions,and smaller spacing, than achievable with direct patterning. Examples ofSAP are described in U.S. Pat. Nos. 8,194,470, and 7,960,266. In someexamples of SAP, a pattern established by photolithography is thenslimmed and sidewalls formed with a lateral dimension approximately halfthe size of the minimum achievable with photolithography, and withspacing approximately half the minimum achievable with photolithography.In some examples, sidewall patterning is repeated so that features maybe formed with a lateral dimension approximately a quarter of the size,and spacing approximately a quarter of the size, of the minimum sizeachievable using direct patterning. However, there are several problemsrelated to repeated SAP operations. A large number of layers isgenerally needed, the number of steps is large, and control of criticaldimensions is difficult.

According to an aspect of the present invention, sidewalls are used toform features having lateral dimensions, and having spacing, that areapproximately a third of the size achievable using direct patterning,using a relatively simple series of process steps that allows goodcontrol of critical dimensions. Thus, pitch can be reduced by a factorof three compared with a direct patterning process, while usingrelatively few layers and relatively few steps, and maintaining goodcontrol of critical dimensions compared with some SAP processes.

FIG. 3A shows a cross section of a stack of layers formed on asemiconductor substrate (e.g. Silicon wafer) at an intermediate stage offabrication. Multiple portions of photoresist 301 have been patterned byphotolithography so that they have a lateral dimension, D, and arespaced apart an equal distance, D. The dimension, D, may be the minimumsize achievable with the photolithographic process used, for example 51nm. Under the photoresist portions is a layer of Spin-On Glass (SOG)303, and under that a layer of Spin-On Carbon (SOC) 305. A transferlayer 307 (of Silicon Nitride, or SiN) underlies the SOC layer 305, witha layer of amorphous Silicon 309 under the transfer layer, and a layerof Silicon Dioxide 311 formed using TEOS (“Pad-TEOS) under the amorphousSilicon layer 309.

Subsequently, as shown in FIG. 3B, the pattern of photoresist portions301 is used as an etch mask during an anisotropic etch (e.g. ReactiveIon Etching, or RIE) that transfers the photoresist pattern tounderlying layers. In particular, the etch patterns the SOG layer 303,and the SOC layer 305. The photoresist portions 301 and SOG layer 303are then removed and sidewall spacers 313 are formed on the sides of SOCportions 305 a-d. In this example, sidewall spacers 313 are formed bydepositing a blanket layer of Silicon Dioxide (SiO2) over SOC portions305 a-d. A sacrificial portion of material on which sidewalls are formedin this way, and which is later removed (such as portions 305 a-d), maybe referred to as a “mandrel.”

Sidewall spacers may be formed of various materials. For example,Silicon Dioxide may be deposited by Atomic Layer Deposition (ALD) to athickness of approximately D/3 (17 nm). The Silicon Dioxide layer maythen be etched back to remove all Silicon Dioxide from top surfaces ofSOC portions 305 a-d, and along the underlying transfer layer 307, whileleaving Silicon Dioxide sidewall spacers 313 as shown. The lateraldimension of the sidewall spacers 313 is approximately the depositedthickness, D/3 (17 nm), and the gap between such sidewall spacers isalso approximately D/3 (original gap was D, with sidewall spacer of D/3on each side, the remaining gap is D/3).

Subsequently, SOC portions 305 a-d are also removed. In an example,removal of SOC portions is combined with etching back of Silicon Dioxideto form sidewall spacers. These two operations may be performed as twodifferent steps (different etch conditions) of a combined process in asingle etch chamber, or using a single etch (i.e. substantially the sameetch conditions throughout).

FIG. 3C shows a cross section of the structure of FIG. 3B followingremoval of SOC portions and deposition of a hard mask material 315,which in this example is amorphous Silicon. The hard mask material 315is deposited so that it fills gaps between sidewall spacers 313 and liesalong sides of sidewall spacers 313 where SOC was removed. Hard maskmaterial is deposited to a thickness of D/3 (17 nm in this example).Subsequently, the hard mask material 313 is etched back.

FIG. 3D shows a cross section of the structure of FIG. 3C after etchingback of the hard mask material 315 to remove hard mask material that ison top of sidewall spacers 313, and where the hard mask material extendsacross the underlying transfer Silicon Nitride 307. The remaining hardmask portions are separated from each other by sidewall spacers 313 andby gaps. There are two different types of hard mask portions. A firsttype of hard mask portion (e.g. portions 315 a) is formed betweensidewall spacers and extends from one sidewall spacer to a neighboringsidewall spacer. Because gaps between sidewall spacers wereapproximately D/3 wide, the first type of hard mask portion has alateral dimension of approximately D/3. A second type of hard maskportion is formed at locations where SOC portions were removed, with twoof the second type of hard mask portion in each such location (e.g.portions 315 b, 315 c). The second type of hard mask portions each liealong a sidewall spacer on one side and have a gap (e.g. gap 317) on theother side (the second hard mask portions may themselves be consideredas sidewall spacers that are formed along sides of original sidewallspacers 313). Etching back of the hard mask material leaves second hardmask portions that are approximately D/3 wide, and separated by gapsthat are approximately D/3 wide.

FIG. 3E shows a cross section of the structure of FIG. 3D after removalof sidewall spacers 313. Hard mask portions (e.g. portions 315 a-c)remain. While there are two different types of hard mask portions thatmay be somewhat different in height, both types of hard mask portionshave lateral dimensions approximately D/3 (17 nm in this example) andare separated from their neighbors (of whichever type) by approximatelyD/3. Thus, a pattern of hard mask portions is established at this stagewith dimensions approximately one third the size of the originalphotoresist portions. Subsequently, this pattern may be used to patternvarious layers used to form components in an integrated circuit.

FIG. 3F shows a cross section of the structure of FIG. 3E after thepattern established by the first and second types of hard mask portionsis transferred to the transfer Silicon Nitride layer 307 andsubsequently transferred to the amorphous Silicon layer 309 thatunderlies the transfer Silicon Nitride layer 307, and after removal ofSilicon Nitride layer 307. Portions of amorphous Silicon 309 a-i remainin a pattern established by hard mask portions (e.g. 315 a-c). It willbe understood that once a pattern of hard mask portions is establishedit may be transferred to one or more underlying layers in order topattern layers from which integrated circuit components are formed. Forexample, a pattern of amorphous Silicon portions such as shown in FIG.3F may be transferred to underlying Silicon Dioxide (Pad-TEOS) layer311, and subsequently to underlying layers including metal and/ordielectric layers used to form components of a memory array (e.g. toform word lines or floating gates).

FIG. 4 illustrates certain steps in the process described above (it willbe understood that there may be additional conventional steps also). Aphotoresist layer is patterned 421 to produce photoresist portions of acertain size. The photoresist pattern is then transferred to an SOClayer 423 where SOC portions are formed. Sidewall spacers are thenformed on the SOC portions 425 by depositing sidewall material andperforming anisotropic etch back to leave sidewalls. The SOC portionsare then removed 427. In some cases etch back of sidewall material andSOC removal may be combined (e.g. performed in the same etch chamber). Alayer of hard mask material is then deposited over the sidewall spacers429. The hard mask material is then etched back to form hard maskportions 431, including first hard mask portions that extend from onesidewall spacer to a neighboring sidewall spacer and second hard maskportions that extend along a sidewall spacer on one side and have a gapon the other side. Sidewall spacers are then removed 433. Additionalsteps (not shown) may transfer the pattern of hard mask portions formedto one or more underlying layers.

While the above example shows certain aspects of the present invention,other process steps may also be used, and process steps may be performedin different orders, and/or different materials may be used.

FIG. 5A shows a cross section of a stack of layers at an intermediatestage of fabrication that is similar to 3D above. In this case, transferSilicon Nitride is replaced with a layer of Silicon Dioxide 551 that isformed using TEOS. Silicon Dioxide layer 551 is formed on amorphousSilicon layer 553, which is formed on Silicon Dioxide (Pad-TEOS) layer555. Both the sidewall spacers 511 and the underlying layer 551 areformed of Silicon Dioxide in this example. An appropriate etch may bechosen that is selective to Silicon Dioxide over amorphous Silicon sothat amorphous Silicon hard mask portions (e.g. portions 515 a-c) andunderlying amorphous Silicon layer 553 remain substantially unaffected.

FIG. 5B shows a cross section of the stack of FIG. 5A after ananisotropic etch is performed to remove sidewall spacers 511, and topattern the underlying Silicon dioxide layer 551. The underlyingamorphous Silicon layer 553 acts as an etch stop so that openings wheresidewall spacers 511 are removed (e.g. opening 557) achieve the samedepth as openings defined by gaps between hard mask portions (e.g. gap559).

Aspects of the present invention are not limited to particularmaterials, but may be implemented with any suitable materials. Forexample, while amorphous Silicon is used as a hard mask layer in theexamples above, Silicon Nitride may be used as an alternative hard maskmaterial which may allow fewer layers (e.g. transfer Silicon Nitride maynot be necessary).

FIG. 6A shows a cross section of a stack of layers at an intermediatestage of fabrication that is similar to FIG. 3C above. However, in thiscase hard mask layer 615 is formed of Silicon Nitride. In the exampleabove, transfer Silicon Nitride was needed to provide selectivitybetween hard mask amorphous Silicon an underlying layer of amorphousSilicon. Here, sidewall spacers 611 and hard mask layer 615 are formeddirectly on an amorphous Silicon layer 609 (which is on Pad-TEOS SiliconDioxide layer 611). A Silicon Nitride hard mask layer may be formed byAtomic Layer Deposition (ALD) or using a Diclorosilane (DCS) basedChemical Vapor Deposition (CVD) process to a depth of D/3 (17 nm in thisexample). This layer may then be etched back using an appropriateanisotropic etch.

FIG. 6B shows a cross section of the stack of FIG. 6A after etching backthe hard mask, Silicon Nitride layer using anisotropic etching, to formhard mask portions (e.g. portions 615 a-c) as before, using an etch thatis selective to Silicon Nitride over amorphous Silicon. Subsequentremoval of sidewall spacers 611 uses an etch that selectively removesSilicon Dioxide while leaving Silicon Nitride hard mask portions andunderlying amorphous Silicon layer.

While the above examples form sidewall spacers on SOC portions(mandrels), sidewalls may be formed on portions of other materials also.A suitable mandrel material may be chosen that is compatible with thesidewall spacer material and hard mask material and with underlyinglayers. In general, it is desirable to use a material for which an etchis available that allows removal of mandrels without significantlydamaging other materials (i.e. a selective etch exists with highselectivity to the mandrel material).

FIG. 7A shows an example where sidewall spacers 711 are formed on sidesof photoresist portions 701. Sidewall spacers 711 are formed of SiliconDioxide that is deposited over patterned photoresist and then etchedback to leave sidewall spacers 711 as shown. Dimensions of sidewallspacers may be D/3 with gaps of D/3 as before. Subsequently, photoresistportions 701 are removed, the pattern of sidewall spacers 711 istransferred to the underlying SOG layer 703 and SOC layer 705, andsidewall spacers 711 and underlying SOG portions are removed. Forefficiency, these steps may be performed in the same etch chamber, forexample an RIE chamber.

FIG. 7B shows a cross section of the stack of layers of FIG. 7A after anRIE chamber is used to remove photoresist, and to anisotropically etchdown through the SOG and SOC layers according to the pattern of sidewallspacers, remove the sidewall spacers, and remove remaining SOG. Thissequence of process steps leaves SOC portions (e.g. portions 705 a, 705b) that are in the same pattern as the sidewall spacers 711.

FIG. 7C shows a cross section of the stack of FIG. 7B after depositionof a hard mask layer 715 over the SOC portions (e.g. 705 a, 705 b). Thehard mask layer 715 may be formed of Silicon Dioxide or other suitablematerial with a thickness of D/3 as before. Because this layer isdeposited on SOC, it may be deposited at low temperature in what may beconsidered an Ultra-Low Temperature (ULT) Silicon Dioxide deposition.

FIG. 7D shows a cross section of the stack of FIG. 7C after etching backof the hard mask layer 715 to leave hard mask portions (e.g. hard maskportions 715 a, 715 b), and after removal of SOC portions (e.g. portions705 a, 705 b). The SOC portions may be removed by an ashing process inthe same chamber that is used to etch back the hard mask layer 715 (e.g.an RIE chamber used for anisotropic etch and for ashing). While thisexample does not directly use sidewall spacers to define hard maskportions, it uses a pattern that is established by sidewall spacers andthen transferred to SOC portions, with the pattern of hard mask portionsthen established by SOC portions. So hard mask portions are similarly oftwo types, a first type that is defined on both sides by locations ofsidewall spacers, and a second type that is defined on only one side bya location of a sidewall spacer.

FIG. 8 illustrates certain steps used in a process as described in FIGS.7A-7D. A photoresist layer is patterned 861 as before to have featureswith size D, that are spaced apart a distance D. Then, sidewall spacersare formed along sides of the photoresist portions 863, with sidewallspacers having a width about D/3. The pattern of sidewall spacers isthen transferred to an underlying SOC layer 867. A hard mask material isdeposited 869 over the patterned SOC to a thickness of about D/3. Thehard mask layer is etched back to form individual hard mask portions871. The SOC portions are then removed 873.

While the above examples are concerned with forming very small featuresin a memory array, in many cases it is desirable to form larger featureson the same die. For example, certain devices formed in the peripheralarea of a memory die may be required to have dimensions larger thanthose in the array. The above processes for forming small features in amemory array are compatible with forming larger features in other areasand this may be achieved in any suitable manner including, but notlimited to, the example described below.

FIG. 9A shows an example where hard mask portions 915 have been formedhaving very small dimensions (e.g. mask portions having dimensions D/3as described in any of the above examples). The hard mask portionsoverlie an amorphous Silicon layer 909 and a Silicon Dioxide (Pad-TEOS)layer 911. After the hard mask portions 915 are formed, an SOC layer 981is formed overlying the hard mask 915 portions and an SOG layer 983 isformed on top of SOC layer 981. Subsequently, a photoresist layer may beformed and patterned into photoresist portions (e.g. photoresist portion985) to define features in the periphery, while leaving the array areaopen. Subsequently, anisotropic etching (e.g. RIE) may be performed toremove SOG layer 983 and SOC layer 981 in the array area, and inunmasked areas of the periphery. Thus, hard mask portions 915 remain todefine small features in the array area, while larger SOG and SOCportions define larger features in a peripheral area.

FIG. 9B shows the cross section of FIG. 9A after transfer of the patternof hard mask portions to the underlying amorphous Silicon layer 909 andtransfer of the photoresist pattern, including photoresist portion 985,to the same amorphous Silicon layer to establish amorphous Siliconportions 909 a-g. The amorphous Silicon layer may be considered a hardmask layer that defines both small features and large features.Amorphous Silicon portions 909 a-f correspond to hard mask portions 915,which each have a lateral dimension of D/3; while amorphous Siliconportion 909 g corresponds to photoresist portion 985 and therefore has alateral dimension that is at least D, where D is the minimum featuresize achievable by direct patterning. Thus, the above examples ofproducing very small features in one area of an integrated circuit (e.g.memory array area) are compatible with producing larger features inanother area of the same integrated circuit (e.g. peripheral area).Examples below are similarly compatible with producing larger features.

Processes without SOC

The above process examples use SOC as one of the materials in forming amemory array. However, SOC is not essential, and other processes may beused that do not require SOC. An alternative process for producingfeatures with a lateral dimension of D/3 from an original pattern havinglateral dimensions of D is shown in FIGS. 10A-10G. This process does notrequire SOC. In FIG. 10A a stack of materials is formed on a substrateand a photoresist layer is formed and patterned on top to formphotoresist portions 1001 with lateral dimensions D, and spacing D.Underlying the photoresist portions is an antireflective coating layercontaining Carbon, “CTL layer” 1003, then a layer of sacrificial SiliconNitride 1005, then a layer of amorphous Silicon 1007, then an etch stoplayer 1009, which in this case is Silicon Nitride. Under the etch stoplayer 1009 is pad TEOS Silicon Dioxide layer 1011 and other layers (notshown) including layers that are patterned into components of the memoryarray (e.g. floating gate layer of doped polysilicon that issubsequently formed into individual floating gates). The photoresistportions 1001 are used to pattern the stack down to etch stop layer 1009using anisotropic etching so that the pattern of photoresist portions1001 is transferred to underlying layers.

FIG. 10B shows the structure of FIG. 10A after etching using photoresistportions 1001 as a mask. Photoresist portions 1001 and remaining CTL arethen removed to leave portions of sacrificial Silicon Nitride 1005 a-dand portions of amorphous Silicon 1007 a-d formed together in the samepattern. FIG. 10B also shows sidewall spacers 1013 that are formed alongsidewalls of the Silicon nitride and amorphous Silicon portions.Sidewall spacers 1013 may be formed as described above, from SiliconDioxide, by depositing a blanket layer of Silicon Dioxide and etchingback to leave sidewall spacers. The thickness of the Silicon Dioxidelayer is approximately D/3 in this example so that sidewall spacers havea width of D/3 and gaps between sidewall spacers are D/3 wide.

FIG. 10C shows the structure of FIG. 10B after deposition and etch backof an amorphous Silicon hard mask layer that fills gaps between sidewallspacers 1013 and overlies sacrificial Silicon Nitride portions 1005 a-d.This layer may be etched back to approximately the level of the tops ofsacrificial Silicon Nitride portions 1005 a-d, leaving amorphous Siliconhard mask portions 1015 a-c.

FIG. 10D shows the structure of FIG. 10C after removal of sacrificialSilicon Nitride portions 1005 a-d to leave underlying portions ofamorphous Silicon 1007 a-d exposed. A suitable selective etch may beused.

FIG. 10E shows the structure of FIG. 10D after deposition of anotheramorphous Silicon hard mask layer 1017 that extends into the openingsleft by the removal of sacrificial Silicon Nitride portions 1005 a-d.This layer may be deposited to a thickness of D/3 so that openings arepartially filled, with gaps of D/3 remaining in the middle of openings.

FIG. 10F shows the structure of FIG. 10E after etching back amorphousSilicon hard mask layer 1017 to leave hard mask portions (e.g. portions1017 a-d) along sides of sidewall spacers 1013. Etching back amorphousSilicon hard mask layer 1017 also leaves hard mask portions (e.g.portions 1015 a-c) intact between sidewall spacers.

FIG. 10G shows the structure of FIG. 10F after removal of sidewallspacers 1013 to leave first hard mask portions (e.g. portions 1015 a-f)and second hard mask portions (e.g. portions 1017 a-d). The patternshown in FIG. 10G includes two different types of hard mask portions.First hard mask portions 1015 a-b were formed between sidewall spacersand were defined on both sides by sidewall spacers (i.e. the locationsof their sides is determined by locations of sidewall spacers) Thelateral dimensions of these hard mask portions is equal to the distancebetween sidewall spacers 1013 (D/3 in this example). Second hard maskportions 1017 a-d were formed along sides of sidewall spacers and aredefined on only one side by a sidewall spacer. They are defined on theother side by gaps. The lateral dimensions of these hard mask portionsis equal to the thickness of the amorphous Silicon layer 1017 (D/3 inthis example). Thus, using two different types of hard mask portions, apattern is established with portions having a lateral dimension of D/3and spacing of D/3.

FIGS. 11A-11F show an alternative process that is similar to the processof FIGS. 10A-10G. The initial stack of layers shown in FIG. 11A issimilar to that of FIG. 10A except that no etch stop layer is present.Thus, under the patterned photoresist layer (photoresist portions 1101)is CTL layer 1103, then sacrificial Silicon Nitride layer 1105, thenamorphous Silicon layer 1107, then pad TEOS Silicon Dioxide 1111.

FIG. 11B shows the structure of FIG. 11A after etching of the stack inthe pattern established by photoresist portions 1101. However, in thisprocess, the etch stops on the top surface of amorphous Silicon layer1107 instead of patterning amorphous Silicon layer 1107. Sidewallspacers 1113 are then formed on the upper surface of amorphous Siliconlayer 1107 (along sides of Silicon Nitride portions 1105 a-d).

FIG. 11C shows the structure of FIG. 11B after deposition and etch backof a first amorphous Silicon hard mask layer to leave first amorphousSilicon hard mask portions 1115 a-c between sidewall spacers as before.

FIG. 11D shows the structure of FIG. 11C after removal of sacrificialSilicon Nitride portions 1105 a-d to leave amorphous Silicon 1107exposed.

FIG. 11E shows the structure of FIG. 11C after deposition and etch backof a second amorphous Silicon hard mask layer to leave second amorphousSilicon hard mask portions (e.g. portions 1117 a-c).

FIG. 11F shows the structure of FIG. 11E after removal of sidewallspacers 1113 and etching of the amorphous Silicon layer 1107 in thepattern of hard mask portions down to the underlying Silicon Dioxidelayer 1111. Thus, at this point, a hard mask pattern is established oftwo different kinds of hard mask portions, first portions (e.g. portions1115 a-b) which are formed between sidewall spacers and are defined oneach side by sidewall spacers, and second portions (e.g. portions 1117a-c), which are formed on sides of sidewall spacers with a sidewallspacer on one side and a gap on the other side.

FIGS. 12A-C show another process that uses mandrels formed ofsacrificial Silicon Dioxide instead of Silicon Nitride. FIG. 12A shows astack of layers with patterned photoresist portions 1201 on top of CTLlayer 1203, on sacrificial Silicon Dioxide layer 1205, on a transferSilicon Nitride layer 1207, on amorphous Silicon layer 1209, on SiliconDioxide (pad TEOS) layer 1211.

FIG. 12B shows the structure of FIG. 12A after etching the stack usingphotoresist portions 1201 as an etch mask, stopping on an upper surfaceof transfer Silicon Nitride layer 1207. Photoresist and CTL are removedand sidewalls 1213 are formed between sacrificial Silicon Dioxideportions 1205 a-d. In this case sidewall spacers 1213 are formed ofamorphous Silicon that is deposited as a blanket layer and then etchedback to leave sidewall spacers as shown. Sidewall spacers have a widthof D/3 so that a gap of D/3 remains between such sidewall spacers.

FIG. 12C shows the structure of FIG. 12B after removal of sacrificialSilicon Dioxide portions 1205 a-d to leave sidewall spacers 1213.

FIG. 12D shows the structure of FIG. 12C after deposition and etchingback of a Silicon Dioxide layer to fill gaps between neighboringsidewall spacers and to partially fill spaces where sacrificial SiliconDioxide portions were removed. This layer may be deposited to athickness of D/3 so that portions of Silicon Dioxide (e.g. portion 1217a) have a width of D/3 and leave gaps of D/3.

FIG. 12E shows the structure of FIG. 12D after deposition of anamorphous Silicon hard mask layer 1219 that fills gaps between Silicondioxide portions 1217 a-c.

FIG. 12F shows the structure after etching back of the amorphous Siliconlayer 1219 and subsequent removal of Silicon dioxide portions 1217 a-cto leave amorphous Silicon sidewall spacers 1213 and hard mask portions1219 a-f. Amorphous Silicon sidewall spacers 1213 may be considered ashard mask portions and in conjunction with hard mask portions 1219 a-cform a hard mask with portions having a lateral dimension D/3 andspacing of D/3. This pattern may then be transferred to one or moreunderlying layers.

Stepped Mandrels

In an alternative approach, mandrels may be formed with two steps thathave two different lateral dimensions. Then sidewall spacers may beformed on sides of each step and the upper step removed to allow thelower step to be etched in the middle, leaving portions on either side.

FIG. 13A shows a stack of layers that includes portions of photoresist1301 with lateral dimension D and spacing D as before. Underlying thephotoresist portions 1301 is a layer of CTL 1303 formed on a sacrificialSilicon Dioxide layer 1305, on an amorphous Silicon layer 1307, on aBoron doped polysilicon layer 1309, on Silicon Dioxide (pad TEOS) 1311.

FIG. 13B shows the structure of FIG. 13A after etching according to thepattern of photoresist portions 1301 to form separate portions ofsacrificial Silicon Dioxide 1305 a-d and amorphous Silicon 1307 a-d.Photoresist and CTL are removed. The etch stops on the doped polysiliconlayer 1309.

FIG. 13C shows the result of a slimming operation that reduces thelateral dimensions of sacrificial Silicon Dioxide portions 1305 a-d fromD to D/3 to form upper steps while maintaining lateral dimensions ofamorphous Silicon portions 1307 a-d unchanged at D. Thus, steppedmandrels are formed with an upper step having a width D/3 located on themiddle third of an upper surface of a lower step that has a width D.

FIG. 13D shows the structure of FIG. 13C after formation of uppersidewall spacers (e.g. spacers 1313 a-d) and lower sidewall spacers(e.g. spacers 1314 a-f) on sides of both upper and lower steps of thestepped mandrel structures formed of sacrificial Silicon Dioxideportions on amorphous Silicon portions. Such sidewall spacers may beformed as before, by blanket deposition of a sidewall spacer layer (inthis case, a Silicon Nitride layer) followed by etching back. FIG. 13Dalso shows amorphous Silicon portions 1315 a-c filling gaps betweensidewall spacers. Amorphous Silicon may be deposited across thestructure and then etched back to remove excess amorphous Silicon,leaving sufficient amorphous Silicon to fill gaps as shown.

FIG. 13E shows the structure of FIG. 13D after removal of upper steps(portions of sacrificial Silicon Dioxide 1305 a-d) and subsequentetching of lower steps (amorphous Silicon portions 1307 a-d) accordingto the pattern of removed upper steps to form two amorphous Siliconportions each with a lateral dimension of D/3 from each lower step (e.g.portions 1319 a-d). Upper sidewall spacers are removed and amorphousSilicon etched back to leave etched amorphous Silicon portions (e.g.portions 1315 a-b) between lower sidewall spacers (e.g. portions 1314a-d).

FIG. 13F shows the structure of FIG. 13E after subsequent etching toremove sidewall spacers. At this point hard mask portions (e.g. portions1315 a-b and 1319 a-d) are to form a hard mask pattern with portionshaving lateral dimensions of D/3 and spacing of D/3.

The materials used in the example of FIGS. 13A-F are provided asexamples and aspects of the present invention may be practiced with arange of materials. FIGS. 14A-B provide another example of materialsthat may be used. It will be understood that other materials may also beused.

FIGS. 14A-B show an example a process that is similar to that of FIGS.13A-F but using Silicon Nitride as a material for lower steps (e.g.lower steps 1407 a-b) and using amorphous Silicon as a sidewall spacermaterial (the opposite of the example above) for upper sidewall spacers(e.g. upper sidewall spacers 1413 a-c) and lower sidewall spacers (e.g.lower sidewall spacers 1414 a-d). In FIG. 14A, Silicon Nitride portions1415 a-c fill gaps between sidewall spacers and are etched back to alevel that leaves sacrificial Silicon Dioxide portions 1405 a-d exposedfor later removal.

FIG. 14B shows the structure of FIG. 14A after removal of sacrificialSilicon Dioxide portions and etching of Silicon Nitride lower steps(e.g. portions 1407 a-b) in the pattern established by removal ofsacrificial Silicon Dioxide portions 1405 a-d. Upper sidewall spacers(e.g. spacers 1413 a-b) are removed, Silicon Dioxide portions (e.g.portions 1415 a-c) are etched back, and lower sidewall spacers (e.g.spacers 1414 a-d) are removed to leave only the Silicon Nitride portionsshown. These Silicon Nitride portions include first Silicon Nitrideportions 1415 a-c formed between lower sidewall spacers, and secondSilicon Nitride portions 1419 a-c formed from lower steps. All suchSilicon Nitride portions have lateral dimensions of D/3 and spacing D/3.

Slimming may be used to form a stepped mandrel for forming upper andlower sidewall spacers as described above. Alternatively, a steppedstructure may be formed and then transferred to lower layers wheresidewall spacers are formed. For example, FIG. 15A shows an example of astepped structure formed with slimmed steps 1505 a-d that are formed ofsacrificial Silicon Dioxide and unslimmed steps 1507 a-d formed ofSilicon Nitride. Rather than form sidewall spacers on this structure,the pattern is transferred prior to forming sidewall spacers.

FIG. 15B shows the same cross section after etching of underlyingamorphous Silicon layer 1509 according to the pattern of unslimmed steps1507 a-d to form lower steps 1509 a-d, and etching of steps 1507 a-daccording to the pattern of slimmed steps 1505 a-d to form upper steps1507 a-d with a dimension D/3. Thus, the pattern of FIG. 15A has beentransferred down by one layer in this example. Upper and lower sidewallspacers may subsequently be formed, amorphous Silicon deposited, uppersteps removed and used to pattern lower steps, followed by removal ofupper and lower sidewall spacers and etching back of amorphous Siliconto leave a hard mask with individual portions having lateral dimensionsD/3 and spacing of D/3

CONCLUSION

Although the various aspects of the present invention have beendescribed with respect to exemplary embodiments thereof, it will beunderstood that the present invention is entitled to protection withinthe full scope of the appended claims. Furthermore, although the presentinvention teaches the method for implementation with respect toparticular prior art structures, it will be understood that the presentinvention is entitled to protection when implemented in memory arrayswith architectures than those described.

It is claimed:
 1. A method of forming a hard mask layer comprising:forming a plurality of portions of material that have a lateraldimension D which is defined by a photolithographic process and whichare separated by spaces having a lateral dimension equal to D;subsequently forming sidewall spacers along sides of the plurality ofportions of material, gaps between neighboring sidewall spacers having alateral dimension approximately equal to D/3; subsequently removing theplurality of portions of material to leave the sidewall spacers;subsequently transferring a pattern formed by the sidewall spacers toform a plurality of patterned portions of a transfer material;subsequently depositing a hard mask material on the plurality ofpatterned portions of transfer material; subsequently etching back thehard mask material to leave first hard mask portions filling gapsbetween patterned portions of transfer material and second hard maskportions that extend along patterned portions of transfer material onone side and are exposed on another side; and subsequently removing theplurality of patterned portions of transfer material.
 2. The method ofclaim 1 wherein the material is photoresist and the transfer material isSpin-On Carbon (SOC).
 3. The method of claim 2 wherein the plurality ofportions of SOC are removed by dry etching.
 4. The method of claim 1wherein the sidewall spacers are formed of Silicon Dioxide that isdeposited at a low temperature.
 5. The method of claim 1 wherein thehard mask material is silicon dioxide.
 6. The method of claim 1 whereinboth the first and second hard mask portions have lateral dimensions ofapproximately D/3 and spacing of approximately D/3.
 7. The method ofclaim 1 wherein the plurality of patterned portions of the firstmaterial are formed having a lateral dimension determined byphotolithography and wherein the portions of the hard mask material havea lateral dimension that is approximately one third of the lateraldimension determined by photolithography.
 8. A method of forming anintegrated circuit comprising: forming a plurality of patterned portionsof a first material; subsequently forming sidewall spacers alongsidewalls of the plurality of patterned portions of the first material;subsequently removing the plurality of patterned portions of the firstmaterial; subsequently transferring a pattern formed by the sidewallspacers to form a plurality of patterned portions of a transfermaterial; subsequently forming a layer of hard mask material overlyingthe plurality of patterned portions of transfer material; subsequentlyetching back the layer of hard mask material to leave portions of thehard mask material between patterned portions of transfer materialincluding first portions of the hard mask material that are in contactwith patterned portions of transfer material on both sides and secondportions of the hard mask material that are in contact with patternedportions of transfer material on only one side; subsequently removingthe patterned portions of transfer material; and subsequently using theportions of the hard mask material to pattern one or more layers on asubstrate.
 9. The method of claim 8 wherein the first material isphotoresist.
 10. The method of claim 9 wherein the sidewall spacers areformed of Silicon Dioxide that is deposited at a low temperature. 11.The method of claim 9 wherein the hard mask material is silicon dioxide.12. A method of forming an integrated circuit comprising: forming aplurality of patterned portions of photoresist; subsequently formingsidewall spacers along sidewalls of the plurality of patterned portionsof photoresist; subsequently removing the plurality of patternedportions of photoresist; subsequently transferring a pattern formed bythe sidewall spacers to form a plurality of patterned portions of atransfer material; subsequently forming a layer of hard mask materialoverlying the patterned portions of the transfer material; subsequentlyetching back the layer of hard mask material to leave hard mask portionsbetween the patterned portions of the transfer material, the hard maskportions including first hard mask portions that are in contact withportions of transfer material on both sides and second hard maskportions that are in contact with portions of transfer material on onlyone side; subsequently removing patterned portions of the transfermaterial; and subsequently using the hard mask portions to pattern oneor more layers on a substrate.
 13. The method of claim 12 wherein theplurality of patterned portions of photoresist have a lateral dimensionof approximately D and are spaced apart a distance approximately equalto D, and the hard mask portions have a lateral dimension approximatelyequal to D/3 and are spaced apart a distance approximately equal to D/3.14. The method of claim 12 wherein the sidewall spacers are formed ofSilicon Dioxide.
 15. The method of claim 12 wherein the transfermaterial is Spin On Carbon (SOC).